ESD150-3T

The ESD150-3T is a compact endless diamond wire saw machine for high-precision cutting of hard, brittle and valuable materials. It supports automated operation, low cutting force and thin-section sample preparation for laboratory and small-workshop applications.

1.High-Precision Cutting

The cutting precision reaches ±0.05mm, with a surface roughness as low as Ra 0.5μm, meeting the demands of high-precision processing.

Suitable for cutting ultra-thin materials, with a minimum cutting thickness of 0.1mm.

2.Multi-Functional Applicability

Capable of cutting various hard and brittle materials, including silicon wafers, sapphire, ceramics, glass, stone, composite materials, and more.

Wide cutting thickness range, from 0.1mm to 50mm, catering to different material requirements.

3.High-Efficiency Cutting Speed

The cutting speed can reach up to 20mm²/min, significantly improving experimental and production efficiency.

Automated cutting mode reduces manual intervention and enhances consistency.

4.Compact Desktop Design

The equipment features a small footprint, occupying only 0.5㎡, making it ideal for laboratories and small workshops.

The user-friendly interface supports one-click operation, ensuring ease of use.

5.Low Consumable Costs

The diamond wire has a long service life, with a single wire capable of cutting over 1000 meters of material, reducing consumable costs.

The equipment is easy to maintain and has low operating costs.

In addition to the aforementioned areas, we can also cut many other materials and provide free trial cutting services and one-stop ODM services. If you have any technical questions, we can provide free technical consultation. Please feel free to contact us!

1.The hardness of your material and the size of the materials before cutting.

2.The cutting method which is best for your material.

3.If any special request for cutting.