2024 - 12 - 05

The impact of diamond wire loop on the photovoltaic industry

At present, according to different crystal structures, silicon wafers for crystalline silicon solar cells are divided into monocrystalline silicon and polycrystalline silicon, which can be used to produce battery modules. In order to solve the processing problem of large-size silicon wafers, the traditional cutting method using mortar as abrasive is adopted internationally, and diamond wire cutting technology is not widely used.  At present, how to reduce the cost and improve the production efficiency of photovoltaic modules has become an urgent problem to be solved in the development of photovoltaic industry. The cutting cost control of monocrystalline silicon wafer and polycrystalline silicon wafer has become the focus of enterprises. The current situation of the photovoltaic industry in recent years In recent years, the competition among photovoltaic enterprises has intensified, and the price of crystalline silicon photovoltaic modules has decreased all the way, which puts forward the requirements for silicon wafer production and processing enterprises to further reduce costs.  As a new cutting technology, diamond wire cutting has the advantages of sheet cutting, reducing notch loss, reducing silicon material loss, improving processing efficiency, improving chip yield and reducing sewage and COD discharge. It can greatly reduce the cost of silicon wafer production enterprises...

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2024 - 11 - 29

Factors Affecting Diamond Wire Tension

When operating a diamond wire cutting machine, craftsmen often mention using varying tensions like 50 kilograms for one material and 30 kilograms for another. Today, we explore why the tension of diamond wire is crucial for processing precision, linking back to factors influencing the cutting machine’s precision discussed in “Factors Influencing Precision in Diamond Wire Cutting Machines.” Diamond Wire Tension: Key Considerations Diamond wire tension varies based on the material being processed and its dimensions. Different mechanical properties and workpiece thickness affect chip removal during cutting, influencing processing accuracy. It’s essential for the diamond wire to remain straight during cutting, requiring prompt tension adjustments if any slack is detected. Understanding Diamond Wire Tension Diamond wire tension represents the force applied by the machine when cutting a material. The amount of tension applied depends on the condition of the diamond wire during cutting. For instance, new diamond wire exerts greater cutting force until worn, ideally maintaining a straight line while cutting. If the wire shows signs of bowing or sagging, it indicates slackness and requires increased tension to retain a taut, straight line. As diamond wire wears during cutting, it elongates, necessitating continual tension adjustments to ensure a straight cutting path...

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2024 - 11 - 22

Influence of Diamond Wire on The Development of Photovoltaic Industry

Industry status At present, according to different crystal structures, silicon wafers for crystalline silicon solar cells are divided into monocrystalline silicon and polycrystalline silicon, which can be used to produce battery modules. In order to solve the processing problem of large-size silicon wafers, the traditional cutting method using mortar as abrasive is adopted internationally, and diamond wire cutting technology is not widely used.  At present, how to reduce the cost and improve the production efficiency of photovoltaic modules has become an urgent problem to be solved in the development of photovoltaic industry. The cutting cost control of monocrystalline silicon wafer and polycrystalline silicon wafer has become the focus of enterprises. In recent years, the competition among photovoltaic enterprises has intensified, and the price of crystalline silicon photovoltaic modules has decreased all the way, which puts forward the requirements for silicon wafer production and processing enterprises to further reduce costs.    As a new cutting technology, diamond wire cutting has the advantages of sheet cutting, reducing notch loss, reducing silicon material loss, improving processing efficiency, improving chip yield and reducing sewage and COD discharge. It can greatly reduce the cost of silicon wafer production enterprises and improve the quality of silicon wafers....

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2024 - 11 - 21

Techniques for Managing Endless Diamond Wire Saw Cutting Gaps

When equipped with a high-precision endless diamond wire saw cutting machine, users can determine cutting precision entirely, allowing for adjustable cutting speeds based on various materials and dimensions. Today, we explore the methods for controlling the gaps in endless diamond wire saw cutting.   On a cutting surface, such as a 245×245mm area, using a 0.25mm endless diamond wire saw typically results in gaps ranging from 0.27 to 0.5mm. Why mention 0.27 instead of 0.25? Endless diamond wire saws carry inherent tolerances; exceptionally precise cuts align with the wire saw diameter, representing the positive tolerance of the wire saw.   The gap’s variability depends on the curvature of the endless diamond wire saw within the work area. While the sample’s structure remains unchanged during cutting, the firmness of its fixation and the possibility of slight vibrations during the cutting process can impact the gap width. 1.Summarizing Gap Control Methods: 1.1Maintaining Constant Tension: The fundamental principle behind endless diamond wire saw cutting machines is to maintain a constant tension within the working area, ensuring the production of high-precision workpieces.    It is crucial to keep the section of endless diamond wire saw in contact with the workpiece under constant tension during...

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