Home > News > Company News > Ensoll Achieves Breakthrough in Unsintered SiC Cutting with Diamond Wire Saw Technology
Zhengzhou, China – July 30, 2025 – Ensoll Technologies (https://www.ensolltoolstec.com/), a leading innovator in diamond wire saw cutting machines, has successfully completed precision cutting trials of unsintered silicon carbide (SiC), achieving remarkable results that have established a new partnership with a major advanced materials manufacturer.
Unprecedented Cutting Performance
The demonstration showcased Ensoll’s cutting-edge diamond wire saw technology delivering:
– Achieved flatness ≤0.01mm
– Meets stringent semiconductor and optical device requirements
✔ Perfect Surface Quality
– Surface roughness Ra 0.2-0.5μm
– Ultra-mirror finish without chipping or microcracks
– 3× better than traditional processing methods
✔ Intelligent Process Control
– Closed-loop compensation system
– Real-time error correction
– Guaranteed batch consistency
– Single-shot forming eliminates secondary processing
– Significant production efficiency improvements
|
Parameter |
Specification |
|
Machine Model |
DWS-GT450 |
|
Wire Diameter |
0.45mm |
|
Cutting Accuracy |
±0.05mm |
|
Max Tube Diameter |
150mm |
|
Cutting Speed |
Adjustable 2-10mm/s |
Strategic Partnership Formed
The successful trial has resulted in:
– Purchase agreement for multiple DWS-SiC250 systems
– Technical collaboration for process optimization
– Joint development of specialized SiC cutting solutions
Industry Applications
Ensoll’s solution enables precision manufacturing of:
Our diamond wire saw cutting machines feature:
– Proprietary wire tension management
– Vibration-dampened cutting platform
– AI-powered process optimization
– Modular design for various materials
Contact Our Precision Cutting Experts
📞 +86 19139776428
If you have any question, please contact us
