Join us on the final day of the Shenzhen International Optoelectronic Exposition for an exclusive look at the ESO-GM Diamond Wire Saw Cutting Machine in action! Designed for high-precision cutting of hard and brittle materials such as silicon carbide, glass, ceramics, and crystals, the ESO-GM combines advanced diamond wire technology with exceptional stability and cutting accuracy.
Stop by our booth to:
Watch real-time cutting demonstrations
Learn how the machine improves efficiency and reduces material waste
Discuss your specific application needs with our engineers
This is your last chance to see the ESO-GM perform live and discover how it can enhance your production and R&D processes.
📌 Location: Hall 3, Booth D12
🕙 Demo Times: 10:30 AM, 1:30 PM, 3:30 PM
Perfect for professionals in semiconductor, optics, new energy, and materials science—don’t miss this opportunity!
If you have any question, please contact us